POLY/Solv RS-70 is a highly concentrated solution designed to economically and efficiently strip most of the commercially available, fully aqueous dry film resists. POLY/Solv RS-70’s unique formulation contains penetrating additives designed to reduce entrapment of dry film in areas exhibiting tin or tin/lead over-plate. Additionally, POLY/Solv RS-70 does not include sodium, potassium, or ammonium hydroxide, or alcohols (including methanol), reducing alkaline attacks of copper, tin, and solder. As such, POLY/Solv RS- 70 is easier to waste treat and exhibits less odor than many competitive products. POLY/Solv RS-70 was formulated to produce stripped resist particles averaging 0.2 – 0.5 cm in diameter (with most dry films), facilitating resist particulate filtration. POLY/Solv RS- 70 also incorporates a unique blend of inhibitor compounds to minimize corrosion of tin-lead and/or solder on hard boards and leaves a bright, stable, oxide free copper surface suitable for AOI inspection.
