ENVIRO/Flow HAL-54

Product Code

0005654

Product Description

ENVIRO/Flow HAL-54 is a unique blend of ingredients formulated for use in a horizontal hot air leveling process. ENVIRO/Flow HAL- 54 will remove light copper oxides and lay down a protective layer of flux to protect soldermask and promote good solderability of copper pads. ENVIRO/Flow HAL-54 will provide a bright uniform solder finish with good rinsability. ENVIRO/Flow HAL-54 is a solvent free flux, non-foaming formulation that is compatible with LPI and dry film soldermasks.

Performance Features

  • Removes light copper oxides
  • Protects soldermask
  • Promotes excellent solderability of copper pads

More Products

AN 200

AN 200 is a 40% aqueous solution of an organic sulfide.

PRO/Strip 2101-B

PRO/Strip 2101-B is the second step of a twostep, nitric acid based tin and tin-lead stripping solution designed specifically for dual tank dip applications.

PC-450

PC 450 is a carbonate based, liquid developer concentrate for developing fully or semi aqueous dry films and/or liquid photo imagable solder masks.
Seacole Logo Horiz Rgb 400px.png

Contact Us

Contact Us to Order Products