ENVIRO/Etch Make-up is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry film lamination, oxide treatment, electroless copper deposition, and final finishing processes. ENVIRO/Etch Make-up leaves a uniformly clean and micro-roughened copper surface, promoting improved dry film to copper adhesion, copper to copper adhesion, and HAL solder to copper adhesion.
ENVIRO/Etch Make-up can be operated in spray or immersion applications, offers a wide operating window, is easy to make-up and maintain, and yields a consistently uniform micro-roughened copper surface. ENVIRO/Etch Make-up is capable (based upon concentrations at make-up) of etching copper at rates from 10 – 800 micro-inches per minute, making it versatile enough to be operated as a continuous spray final etch.
